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News - February 2010

Formed in 2001 and with Nokia M2M know-how Teltonika are fast becoming a Market leader of Wireless Solutions employing over 300 staff.

The product range includes GSM/ GPRS/ Edge Modules and Modems along with HSUPA /3G dongles and Routers. The range is being expanded to include WiMAX USB Dongles and Modems. The factory also produce a wide range of complete M2M solutions for this fast expanding market place.

To learn more about the Teltonika product range please contact the sales office on 01189 324600 or email sales@broadband.uk.com

Teltonika product lines can be found on our website: http://www.bt2000.co.uk/page38.htm

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News - December 2009

 

 

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News - November 2009

InvenSense have announced that the planned development of their 6 Axis Gyro has been shelved. Market research has suggested a better product which has been designated the ITG-3200, a triple axis digital gyro. They expect to launch in Q3 2010 and is expected to be very low cost and thus ideal for volume applications.

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News - October 2009

 

Vincotech Announces First SiRFstarIV Modules

With new SiRFaware technology you never walk alone

Munich, Germany - October 26, 2009 - Vincotech, a leading supplier of GPS receiver and telematics hardware solutions, announces the first modules based on the new SiRFstarIV technology. Vincotech module designs integrating the new GSD4e chip open the door for enhanced GPS receiver capability across a broad range of customer applications, including telematics, commercial and consumer mobile devices, providing a level of performance as never seen before.

The SiRFstarIV technology in CSR's latest GSD4e chip addresses the most pressing questions asked of a GPS receiver across a broad spectrum of applications demanding optimal performance in less than ideal operating environments. The first requirement is the availability of position information to the receiver, as needed, when needed. The GSD4e chip, with SiRFaware technology, provides hot start positional fix within a matter of seconds, regardless of the power-off state of the receiver before a fix was requested. SiRFaware maintains hot start conditions continuously and can provide an accurate position within seconds. Secondly, position data will be available and continuously maintained under even the harshest environmental conditions. With -160dBm navigation sensitivity (calculating new positions) and -163dBm tracking sensitivity (following the satellites' signals) the GSD4e GPS technology creates an unimaginable enhancement in the user experience.

 In addition, the SiRFaware mode addresses a requirement that is becoming increasingly critical in the integration of GPS receiver capability in mobile devices; namely, minimizing power consumption to the lowest possible level. In this mode the GSD4e draws as little as 50 to 400µA.

As mobile device product designs and application development evolves to address market requirements, the need for GPS receiver technology to be integrated efficiently alongside other wireless interfaces, including WLAN, Bluetooth and Zigbee becomes apparent. The new GSD4e chip technology, having the capability of detecting, attenuating and even removing jamming signals completely, alleviates the issue of having multiple radios functioning effectively alongside the SiRFstarIV GPS receiver in a mobile device. During the design phase of new products such jammers can be detected and therefore attenuated if not eliminated. In addition, with its active jammer removal capability, the GSD4e is the solution that addresses the issue of external jammers that can't be controlled. This could be motors or deliberately transmitted jamming signals within the L1 band intended to prevent GPS receivers from calculating a position. The GSD4e is capable of detecting and removing up to 8 different jamming sources.

The first GSD4e based modules by Vincotech are designed for efficient integration into mobile devices, including telematics applications, with integrated passive antenna as an option, and highest sensitivity and earliest availability of a fix being the principle objectives.

Vincotech's first module, the A2100-A, integrates the GSD4e along with external flash and adapts the 1.8V technology to the 3.3V rail widely used in the telematics world. Furthermore, in facilitating a fast, seamless upgrade path for the leading A1084-B SiRFstarIII based module, the new A2100-A is pin and footprint compatible with its SiRFstarIII based predecessor. In addressing the development of a broadening array of mobile devices requiring advanced GPS technology integration, more modules based on the two variants of the GSD4e will follow. Emphasis on features and functions will include antenna modules, implementation of 1.8V technology, and a size optimized ROM version. Additionally, the integration of the SiRFstarIV technology into Vincotech's own telematics platforms is foreseen in the near future.

Vincotech is a trademark.

ABOUT VINCOTECH

Vincotech develops and manufactures subsystems and electronic components and offers manufacturing services geared to help customers to master complex challenges in electronics integration. Vincotech's extensive portfolio encompasses standard and tailored solutions, engineering services, and technical support for customers worldwide. These products and services contribute to sustainable, environmentally sound solutions that help modern society embrace mega-trends and explore new avenues.

With approximately 600 employees worldwide, backed by vast experience and a long history in electronics integration, Vincotech leverages these assets to help customers achieve maximum market success.

To learn more about Vincotech, please visit www.vincotech.com.

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The BT2000 team succesfully moved its offices to Finchampstead. The New phone number 01189 324600 and warehouse is capable to meet the long term future growth of the company.

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Arctic Silicon Design teams up with Broadband Technology to sell its innovative range of hi performance and low power ADCs

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News - July 2009

Contact Us 

 

MEMSIC Launches New Family of Out-of-Balance (OOB) Sensor Modules

ANDOVER, Mass., Jul 16, 2009 (BUSINESS WIRE) -- MEMSIC, Inc. (Nasdaq: MEMS), a leading MEMS solution provider, combining proprietary MEMS technology with advanced mixed signal processing and system solutions, today announced the release of its new family of Out-of-Balance (OOB) Sensor Modules, the MXC62XXXGMW, specifically designed for consumer washing machine applications. This family of sensors is packaged in a module which is easily assembled onto the outer basket of the washing machine, thereby easing customer's design-in and test, and the overall reliability of the OOB solution.

Accurate OOB detection and vibration sensing capabilities are some of the most important features needed for more efficient and faster-spinning washing machines. The characteristics of the load can significantly affect the balance during the course of the wash cycle, and the only way to prevent mechanical problems during the high speed spinning cycle is to detect, assess or even predict possible OOB conditions.

The MXC62XXXGMW family of OOB modules employs state-of-the-art MEMS accelerometers produced by MEMSIC, Inc. The accelerometer is equipped with on-chip mixed signal processing and an I²C bus, allowing the device to be connected directly to a microprocessor, eliminating the need for A/D converters or timing resources. The MEMSIC accelerometer data accurately reflects the OOB condition of the washing machine's outer basket. Washing machine developers are thereby able to detect the existence of a basket OOB condition and take further action to correct it, which may include a manual alarm system or an automatic re-balance operation.

Because the MXC62XXXGMW is based on MEMSIC's proprietary heat convection design which does not use a moving mass inside the chip, it is inherently more reliable than other sensor technologies in the harsh vibration and EMI environment of a washing machine. The reliability of the MXC62XXXGMW has been proven in production with MEMSIC's lead customer for this family of modules.

The MXC62XXXGMW is avail

able immediately.

About MEMSIC...

Headquartered in Andover, Massachusetts, MEMSIC, Inc. provides advanced semiconductor sensor and system solutions based on integrated micro-electromechanical systems or MEMS technology and mixed signal circuit design. MEMSIC's unique and proprietary approach combines leading edge sensor technologies, such as magnetic sensors and accelerometers, with mixed signal processing circuitry to product reliable, high quality, cost effective solutions for automotive, consumer and industrial markets. 

Summit Introduces Tiny, Programmable USB/AC Switch-mode Battery Chargers with Integrated CurrentPath™ Manager

SUNNYVALE, CALIF. - July 15, 2009 - Summit Microelectronics has introduced two more members of its third-generation programmable battery charger integrated circuit (IC) family. The SMB136 and SMB137B employ CurrentPath technology, providing dual input source (USB or AC/DC) with arbitration, dual output for system and battery and system operation with a dead or missing battery. Both products support all battery charging standards: USB 2.0 Specification, USB On-The-Go Supplement, USB Battery Charging Specification 1.0, IEEE1725 Standard, Chinese USB Charging Specification, and others. Furthermore, the SMB136 and SMB137B are the only battery charger ICs with CurrentPath to detect the input source type (USB host/hub, AC/DC, etc.) and automatically optimize operation for the fastest and safest battery charging. Both products meet the European Union Memorandum of Understanding, issued on June 29th, 2009, for standardized mobile phone charger.

Features

The SMB136 and SMB137B are based on a 3MHz, switch-mode architecture, with minimal external components, which allows for very efficient power delivery and extremely compact solution size. High-efficiency operation enables fast charging due to higher output/charge currents, while reduced thermal dissipation improves user comfort, system reliability and Green operation (www.summitmicro.com/MobileGreen). Furthermore, Summit's proprietary TurboCharge™ patent-pending technology enables high charge current, even from relatively low-power sources (example: up to 750mA output from 500mA USB source). As consumer devices continue to employ larger batteries, the SMB136 and SMB137B reduce charge time for consumer convenience.

The SMB136 and SMB137B incorporate CurrentPath functionality to allow both input and output current path control. The SMB136 features one power input (USBIN) that allows USB500/100 or AC/DC (700-1400mA) operation. The SMB137B features two power inputs, one for supporting AC/DC power sources and the second one for supporting USB power sources. Both solutions provide independent output current paths for the system and the battery, allowing the system to turn on with a missing or deeply-discharged battery. This charging configuration reduces the charge and discharge cycles on the battery, thereby extending its operating life. CurrentPath also allows accurate charge termination, since both devices can detect the current flowing into the battery vs. traditional solutions that can only detect the combined current for battery and system.

Both the SMB136 and the SMB137B offer Summit's proprietary, patent-pending, Low-Battery Recovery (LBR) mode, which provides two benefits: a) enables booting up from a USB1 source and a "dead" battery (common scenario for smart phones and media players) and b) extends battery run time for emergency operation. This is accomplished by running the battery charger in reverse (boost) and providing the system with 4.17V at up to 500mA. Furthermore, this technology eliminates the need for expensive buck/boost regulators in systems with extended voltage range Li+ batteries (less than 3.0V).

"Consumers expect their feature-rich portable electronics to charge quickly, conveniently and to power up instantly, under all conditions. Addressing this need while supporting USB and safety compliancy can be accomplished cost-effectively by Summit's new CurrentPath battery charging solutions," stated George Paparrizos, Summit marketing director. "Proprietary technologies, CurrentPath, TurboCharge™ and LBR significantly reduce charge time, extend run time and improve consumer convenience."

Like all products in the SMB339 family, the SMB136 and SMB137B also allow true universal USB and AC/DC battery charging. Both solutions incorporate Automatic Power Source Detection to differentiate between a USB 2.0 port and a "USB" AC/DC adapter. Furthermore, the SMB136 and SMB137B offer Summit's proprietary Automatic Input Current Limit (patent pending), which detects the maximum current capability of the AC/DC adapter and automatically programs the devices' input current limit accordingly. These two features enable true, universal USB charging and reliable and safe phone operation without the need for additional hardware and software support.

Like its predecessors, both products support USB On-the-Go (OTG) with integrated VBUS power and a current capability up to 500mA, without additional components or cost. A full set of programmable safety features are also integrated to support the strictest safety standards, including IEEE1725™ and JISC8714™. These include dual redundant protection for input/output current and voltage, chip and battery thermal protection, hardware and software safety timers, battery missing detection and a variety of status and fault registers. In addition, the chips' parametric programmability allows the implementation of sophisticated embedded charging algorithms, further increasing system performance and reliability.

Applications

The SMB136 and SMB137B are ideal for any portable device, such as mobile phones, smart phones, portable media/MP3 players (PMP), portable GPS navigation devices, portable game consoles, and digital cameras/camcorders (DSC/DCC). The features and integration of the SMB136 and SMB137B make them especially suited for portable devices that require operation even with a missing battery, utilize higher-capacity batteries and feature very compact industrial designs.

Both products operate with an input range from +3.5V to +6.2V input and safely withstand continuous input over-voltage up to +18V (non-operating), while protecting downstream circuitry. Both the SMB136 and the SMB137B are offered in a tiny 3.0mm x 2.5mm, 30-ball, lead-free chip-scale (CSP) with an operating temperature range of -30C to +85C.

 

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News - June 2009

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MEMSIC Launches New Tri-Axis Magnetic Sensor, the Latest in a Series of Sensors Aimed at the Mobile Handset, Consumer and Industrial Markets

ANDOVER, Mass., Jun 23, 2009 (BUSINESS WIRE) -- MEMSIC, Inc. (Nasdaq: MEMS), a leading MEMS solution provider, combining proprietary MEMS technology with advanced mixed signal processing and system solutions, today announced the release of its new Tri-Axis Magnetic Sensor, the MMC3120XM, which will enable the integration of digital compass functionality into a broad range of industrial, consumer, and mobile handset applications.

MEMSIC's new MMC3120XM augments its family of magnetic sensors and is a key component for developers to provide cost-effective solutions which offer greater precision and ease-of-use. The MMC3120XM can measure the earth's magnetic field regardless of the orientation of the device, which is critical for hand held applications.

In addition, when the product is used in conjunction with MEMSIC's dynamic compensation and automatic calibration software, it is able to correct for the effects of local magnetic interference and provide the user with gimbaled compass functionality without required rigorous procedures for manually calibrating the device. These capabilities lead to a more robust and user-friendly solution, while providing the end-user with much more accurate heading information.

This new magnetic sensor will draw only 400 uA of current, making it highly suitable for power sensitive designs.

About Memsic...

Headquartered in Andover, Massachusetts, MEMSIC, Inc. provides advanced semiconductor sensor and system solutions based on integrated micro-electromechanical systems or MEMS technology and mixed signal circuit design. MEMSIC's unique and proprietary approach combines leading edge sensor technologies, such as magnetic sensors and accelerometers, with mixed signal processing circuitry to product reliable, high quality, cost effective solutions for automotive, consumer and industrial markets.

 

PCTEL Acquires Wi-Sys

 

Canadian-Based Specialist in GPS Antenna Technology

CHICAGO, 2009 (BUSINESS WIRE) --

PCTEL, Inc. (NASDAQ: PCTI), a leader in propagation and optimization solutions for the wireless industry, announced that it has acquired Wi-Sys Communications Inc., an Ottawa, Canada based company that specializes in GPS antenna and receiver technology. In 2008 Wi-Sys' proprietary products and technology generated approximately $2.2 million in revenue. PCTEL will pay $2.1 million for Wi-Sys and will fully integrate the Wi-Sys operations into its Antenna Products Group (APG).

"This acquisition is consistent with our focus on high-value antennas for the Enterprise," said Marty Singer, PCTEL's Chairman and CEO. "GPS has been a strong product line for us over the past several years and we have been exploring ways to bring more focus to our efforts in this area. Many of the exciting, new precision GPS antenna applications, such as agriculture, military, and network timing, are in the early phases of deployment and growth. We believe that PCTEL is well positioned to participate in the industry's development," added Singer.

Wi-Sys is known for high quality, low noise and low current products that serve the diversified professional GPS market. The company's core products include a family of magnetic and fixed mount GPS antennas, OEM antennas and integrated GPS receiver-antennas to address GPS requirements at all levels of integration in military, public safety, marine and commercial applications. These products are used in covert antenna applications, commercial vehicle tracking systems and in precision agriculture systems, where they are used for precision spraying and steering systems to minimize chemical costs and enhance agricultural yield.

Wi-Sys' product line includes antennas for GPS L1/L2 and for Iridium(R) and GlobalStar(R) satellite communications systems. With this acquisition, PCTEL will extend its product offering and technology base of GPS antenna-receivers. The Wi-Sys product line will also be sold through PCTEL's existing distribution channels. For more information on PCTEL

Please Contact Us we will be happy to discuss your antenna requirements.

 

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May 2009

ANADIGICS Launches New WiMAX 4G Power Amplifier To Drive Evolution from Fixed-Point to Mobile Services

May 20, 2009

Warren, NJ, May 20, 2009 -- ANADIGICS, Inc. (Nasdaq: ANAD), today launched one of the first mobile WiMAX 4G power amplifiers (PAs) developed for use in the 3.4-3.6 GHz spectrum adopted by broadband wireless service providers in Europe and South America. ANADIGICS, the leading developer of RF power amplifier technology for high-speed data communications, has differentiated the new AWM6433 by optimizing it for mobile WiMAX applications through the delivery of exceptional linearity and efficiency across all output power levels.

ANADIGICS offers manufacturers a complete family of WiMAX PAs that support subscriber products developed for the 2.3-2.4 GHz (South Korea and Malaysia), 2.5-2.7GHz (US, Taiwan, Russia and Japan) and 3.4-3.6 GHz frequency bands. These PAs ensure outstanding mobile performance in USB dongles, data cards, smartphones and notebooks that address the growing WiMAX market. According to a report from Juniper Research, which analyzed over 30 countries, the mobile WiMAX 802.16e market will grow to $23 Billion by 2013, with subscriber levels predicted to reach over 80 million over the same time frame.

ANADIGICS' AWM6433 supports both the IEEE 802.16d-2004 and 802.16e-2005 standards, enabling the design of equipment for use during the transition from fixed-point to mobile technologies. Facilitated by ANADIGICS' WiMAX PAs, this migration is expected to enable a rapid expansion of the customer base for existing networks.

The AWM6433 leverages ANADIGICS' industry-leading RF capabilities to exceed 20% operating efficiency at +24 dBm output power, when powered by a 3.3 V supply, while also meeting ETSI-recommended spectrum mask limits. The AWM6433 is designed to provide an increase in the maximum linear output power with an increase in the supply voltage up to 4.2V; a feature which supports 4G systems that require slightly higher subscriber transmit power levels.

The AWM6433 has the same package footprint and pinout as other products in ANADIGICS' WiMAX PA family to ensure simplified designs and ease of manufacturability for OEMs. ANADIGICS currently offers the AWM6430 and AWM6432, 6 V devices that operate in the 3.4-3.6 GHz frequency band, and the AWM6422 and AWM6423, 3.3 V mobile devices that operate in the 2.5 GHz bands.

Glenn Eswein, Director of Product Marketing for ANADIGICS, states, "The AWM6433 is one of the first power amplifiers available for mobile WiMAX in the 3.5 GHz spectrum, and will power an evolution from fixed-point systems, currently based on the 802.16d standard, to 802.16e mobile platforms.

Joe Cozzarelli, Director of ANADIGICS' Wireless Infrastructure and WiMAX Product Development, adds, "The AWM6433 exhibits high power efficiency not only at the maximum output power levels, but also at lower output power levels. This efficiency translates to substantially increased battery life for consumer applications where the usage model includes a wide range of transmit powers."

The AWM6433 includes an integrated 25 dB step attenuator, output power detector, and input and output RF impedance matching circuits. Offered in a 4.5 x 4.5 x 1.0 mm low-profile module, this highly integrated device minimizes board layout space and enables RF front end solutions for size-constrained applications.

The AWM6433 is manufactured using ANADIGICS' proprietary InGaP-Plus™ process technology, to combine unmatched levels of functional integration with superior RF performance:

• 30 dB Gain
• < 3% EVM at +22 dBm (+3.3 V supply)
• 4% EVM at +23 dBm (+3.3 V supply)
• < 3% EVM at +23 dBm (+4.2 V supply)
• 4% EVM at +24 dBm (+4.2 V supply)

SUNNYVALE, CALIF. - May 18, 2009 - Summit Microelectronics has expanded its third-generation programmable battery charger integrated circuit (IC) family with the introduction of the SMB329. Based on the award winning, highly-integrated SMB339 family, the SMB329 integrates additional features, such as "instant-on", even with a dead battery, and real-time charge current monitoring. Like its predecessors, the SMB329's parameters are programmable in non-volatile memory for power-up configuration, and in volatile memory for in-system adjustments via the I2C host interface. In addition, high-efficiency switch-mode operation and TurboCharge™ mode allow for thirty to fifty percent shorter charging times, while reducing thermal dissipation and wasted power by 80%. The SMB329 supports all relevant interface (USB2.0, USB OTG, USB charging, etc.) and safety (IEEE1725, JICS8714, etc.) standards, resulting in reduced development time and cost associated with system compliancy efforts. Additionally, the SMB329 supports the industry's environmental and Green efforts by enabling universal USB charging, eliminating electronic waste while dramatically reducing energy usage (www.summitmicro.com/mobilegreen).

Features

The SMB329 is based on a 3MHz, switch-mode architecture, with minimal external components, which allows for very efficient power delivery and extremely compact solution size. High-efficiency operation enables fast charging due to higher output/charge currents, while reduced thermal dissipation improves user comfort and system reliability. Furthermore, Summit's proprietary TurboCharge™ patent-pending technology enables high charge current, even from relatively low-power sources (example: up to 750mA output from 500mA USB source). As consumer devices continue to employ larger batteries, the SMB329 reduces charge time for consumer convenience.

The SMB329, like all products in the SMB339 family, provides the means to accomplish true, universal USB charging and to meet the various USB industry standards, without the need for additional hardware and software support. In addition, the SMB329 provides instant-on power from the input source to critical system components, allowing them to wake-up and perform system functions, even with a deeply discharged (dead), or missing battery. The SMB329 provides integrated instant-on operation, improving consumer convenience without the cost and size penalty of alternate implementations. The SMB329 also allows the host to directly measure charge current in real-time, thereby allowing the system to recognize the operating mode it is in, and making necessary adjustments for increasing battery life, monitoring for safety and communicating information to the user. The SMB329's Power Source Detection and Automatic Input Current Limit (patent pending) ensure that the charge current is safely and dynamically optimized regardless of power source capability (USB or AC/DC). The resulting improved user experience translates into fewer service calls, fewer merchandise returns and increased subscriber revenue for wireless carriers.

"The SMB329 further expands Summit's offering of intelligent, high-efficiency battery charging products with the integration of new, innovative features, that solve customers' system design challenges in a very cost effective way," stated George Paparrizos, Summit marketing director. "The SMB329 provides unparalleled design flexibility and integration to enable ultra-compact designs."

In addition to USB battery charging, the SMB329 (like all SMB339 family chargers) supports USB On-the-Go (OTG) with integrated VBUS power without additional components or cost. The SMB329's step-down converter, that normally operates in "forward mode" to charge the battery, can operate in reverse to boost the battery voltage to +5V for USB-OTG and deliver up to 500mA, exceeding the USB OTG Supplement Specification requirements. USB-OTG allows two portable USB devices (phones, digital cameras, etc.) to connect to and/or power each other without the presence of a host PC. This creates virtually unlimited opportunities for mobile connectivity, such as exchange of media files between portable devices or charging a Bluetooth™ headset from a mobile phone.

The SMB329 supports existing and emerging safety standards (IEEE1725, JISC8714 and others) for portable devices including the industry's most complete set of safety features: input/output current limits, input and battery over-voltage protection, battery and chip thermal protection, charge safety and watchdog timers, trickle charging, and status/fault monitors. In addition, the chip's parametric programmability allows the implementation of sophisticated embedded charging algorithms, further increasing system performance and reliability.

Applications

The SMB329 operates with an input range from +3.5V to +6.2V input and safely withstands continuous input over-voltage up to +18V (non-operating), while protecting downstream circuitry. The SMB329 is offered in a tiny 2.3mm x 2.0mm, 20-ball, lead-free chip-scale (CSP) and in a 4x4 QFN-24 package with an operating temperature range of -30C to +85C.

The SMB329 operates with an input range from +3.5V to +6.2V input and safely withstands continuous input over-voltage up to +18V (non-operating), while protecting downstream circuitry. The SMB329 is offered in a tiny 2.3mm x 2.0mm, 20-ball, lead-free chip-scale (CSP) and in a 4x4 QFN-24 package with an operating temperature range of -30C to +85C.

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April 2009

.

April 27, 2009

 

INVENSENSE™ INTRODUCES WORLD'S FIRST DUAL-AXIS
MEMS GYROSCOPES FOR 3D REMOTE CONTROLS AND PC MICE

IXZ™-500 and IXZ™-650 Products Enable Single-Chip In-Plane Sensing of Pitch and Yaw

SUNNYVALE, Calif.,April 27, 2009 - InvenSense, Inc., the leading provider of MEMS-based motion processing products for consumer electronics, today announced the availability of the IXZ™-500 and IXZ™-650 dual-axis MEMS gyroscopes designed specifically for 3D remote controls and PC mice supporting TVs, home theaters, set top boxes and personal computers. The IXZ™ family of dual axis MEMS gyros represents the world's first and only single-chip integrated pitch and yaw (X- and Z-axis) motion processing products that meet the in-plane mounting requirements for both traditional as well as new generations of slim profile remote controls. Designed for audio/video (A/V) remote controls with 3D pointing functionality, the IXZ-500 features a primary output with a full scale range of up to ±500°/second with a ±110°/second internal secondary gain stage output to track slower motions for precise cursor pointing applications.  The IXZ-650 targets digital TV and IPTV remote controls with its ±2,000°/second primary output to track the widest dynamic range of physical motions and a ±440°/second internal secondary gain stage output for on-screen pointing applications.

The rapidly approaching transition to digital TV broadcasting and the increasing quantity of downloadable multimedia content, such as TV shows, movies, music and shopping drives the need for a more intuitive user interface for navigation and selection—from your desk, on the sofa or across the room.  Motion processing, enabled by the IXZ technology, has led to a new class of 3D remote controls with PC mouse navigation capability enabling users to perform in one motion what would typically require six to ten mechanical button clicks. This allows a single-handed motion to quickly scroll through lists of movie titles or change volume by simply tilting the remote to the desired setting. As more content becomes available, these 3D remote controls include a wide full scale range necessary to support the fast and complex hand movements for TV-based interactive multimedia entertainment while also supporting the exacting requirements of cursor control for menu selection.

"InvenSense continues to address the growing market need for motion processing with 'world's first' solutions that address the specific application and market needs of CE products," said Steve Nasiri, CEO and founder of InvenSense. "Current dual-axis gyros are based on pitch and roll (X- and Y-axis) that were originally designed for digital camera image stabilization but do not meet the functional requirements of remote controls. This forces manufacturers to mount the gyros on a daughter board that is perpendicular to the main board, resulting in higher manufacturing costs and additional height requirements."

By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer level bonding, InvenSense has driven the IXZ-family package size down to a small footprint of 4x5x1.2mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging to address the cost sensitive remote control markets. The IXZ-family addresses the key performance parameters of remote control application, including low-noise of 0.015°/s/√Hz, an integrated temperature sensor providing temperature compensated bias adjustment and high cross-axis isolation achieved by its unique design.  InvenSense MEMS gyroscopes set the industry's highest benchmark for robustness supporting 10,000g shock tolerance.

The IXZ-500 and IXZ-650 MEMS gyroscopes are sampling now. Contact InvenSense at www.invensense.com/contact/info_request.html for more information.

About InvenSense
InvenSense is the leading provider of motion processing products for mobile consumer applications, with proven technology and products shipped in millions of units monthly to customers worldwide. The company's patented motion processing technology and Nasiri-Fabrication platform addresses the emerging needs of many mass-market consumer applications such as gaming, image stabilization, remote controls, and handsets that require improved performance, enhanced features, and new and more intuitive motion and gesture-based user-interface solutions. InvenSense is a privately held company with headquarters located in Sunnyvale, California. More information can be found at http://www.invensense.com.

 

ANADIGICS' Powers Leading Global Broadband Embedded Device
April 23, 2009

Warren, NJ, April 23, 2009 -- ANADIGICS Inc. (Nasdaq: ANAD) today announced that it is shipping production volumes of three of the Company's high-efficiency 3G power amplifiers (PAs) for use in an industry leading multi-mode embedded 3G wireless modem, which enables mobile broadband connectivity for notebook users on cellular networks worldwide. ANADIGICS has leveraged its unmatched RF design expertise to develop PAs capable of delivering the superior levels of linearity and efficiency required to drive high quality mobile connectivity to CDMA/EV-DO, EDGE and WCDMA/HSPA 3G wireless networks around the world.

A recent study from In-Stat market research predicted strong growth in 3G data services and cellular modem deployments, with shipments already reaching 20 million units in 2008.The study claims that two big trends are the move in form factor to USB modems and the growing emphasis on embedded modems, led by Ericsson and Qualcomm. Embedded shipments are expected to overtake external modem shipments by the end of 2011.

"Lack of global connectivity and multi-operator compatibility has been a major barrier to widespread adoption of embedded 3G modules in notebook computers. The new generation of embedded modules offer a breakthrough solution for global 3G broadband connectivity beyond WiFi for note-book and net-book computers," says Dr. Ali Khatibzadeh, Senior Vice President and General Manager of RF Products at ANADIGICS, Inc. "The adoption of the new HELP3™ WCDMA/HSPA power amplifiers for these modules expands ANADIGICS' 3G market share into notebook and net-book computers."

The three ANADIGICS WCDMA/HSPA power amplifiers being shipped enable operation in the IMT, PCS, and Cellular bands for this embedded module. These devices are differentiated by their linearity and efficiency which are all necessary for a highly satisfying broadband mobile experience for consumers. Each PA incorporates ANADIGICS' proprietary third-generation high-efficiency-at-low-power (HELP3™) technology, which reduces average current consumption by as much as 75%, compared to a conventional PA device. Additionally, ANADIGICS' InGaP-Plus™ technology ensures the devices deliver state-of-the-art reliability, temperature stability, and ruggedness.

For additional information, contact ANADIGICS by phone (908) 668-5000 or FAX (908) 668-5132 or visit the Company's Web site at: www.anadigics.com.

About ANADIGICS, Inc.

ANADIGICS, Inc. (Nasdaq: ANAD - News) is a leading provider of semiconductor solutions in the rapidly growing broadband wireless and wireline communications markets. Founded in 1985 and headquartered in Warren, NJ, the company's award-winning products include power amplifiers, tuner integrated circuits, active splitters, line amplifiers, and other components, which can be sold individually or packaged as integrated radio frequency and front end modules. For more information, visit www.anadigics.com.